Heat sink for integrated circuit package

Details Heat sink for integrated circuit package Heat sink for integrated circuit package

1984-07-06

1986-08-26

Richter, Sheldon J.

Heat exchange

With retainer for removable article

Electrical component

165185, H01L 2340

Patent

active

046076859

ABSTRACT:
A heat exchange attachment device for integrated circuits is presented which eliminates any need for contact with adhesive pastes or solder. A snap-on holding piece permits a finned cooling unit to be threaded through an aluminum base plate attached to the pin grid array package so that a threaded shaft of the cooling unit may be screwed into adjustable contact with a beryllium oxide disk mounted on the integrated circuit package.

REFERENCES:
patent: 3241605 (1966-03-01), Tabor
patent: 3261904 (1966-07-01), Wulc
patent: 3874443 (1975-04-01), Bayer
Combined Heat Conductor and Protective Transistor Package, Hardwick-BTL et al., Western Electric Technical Digest, No. 25, Jan. 1972, pp. 39-40.

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