Heat sink for integrated circuit

Details Heat sink for integrated circuit Heat sink for integrated circuit

2000-06-26

2001-11-20

Flanigan, Allen (Department: 3743)

Heat exchange

With retainer for removable article

Electrical component

C361S704000

Reexamination Certificate

active

06318451

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat sink for an Integrated Circuit, and particularly to a heat sink for a flip chip processor.
2. The Related Art
With new developments in the computer industry, an integrated circuit, such as a flip chip processor, generates a large amount of heat due to its high speed of operation. If the heat accumulates in the integrated circuit, the stability of the computer system may be damaged. To solve this problem, a heat sink is mounted on the integrated circuit to dissipate heat therefrom.
Referring to
FIG. 1
, a conventional heat sink
10
comprises a heat dissipating base
14
having a flat bottom face (not labeled) and a multiplicity of fins
18
extending from an opposite top face of the base
14
. The heat sink
10
is mounted to a flip chip processor
20
with the bottom face engaging the flip chip processor
20
.
A flip chip processor
20
, as shown in
FIG. 2
, comprises a substrate
24
on a top face of which a flip chip
22
is formed. When the heat sink
10
is mounted to the flip chip processor
20
, a die edge
23
of the flip chip
22
is first contacted by the flat bottom face of the base
14
of the heat sink
10
and then the heat sink
10
is rotated about the die edge
23
to compensate for the height H of the flip chip
22
to form surface contact with the flip chip
22
. The rotation of the heat sink
10
about the die edge
23
may cause damage to the die edge
23
of the flip chip
22
.
Furthermore, due to the flat bottom surface of the base
14
, the heat sink
10
may not be properly positioned on the flip chip processor
20
. Relative movement between the heat sink
10
and the flip chip processor
20
may occur.
It is desired to provide a heat sink to solve the above problems.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a heat sink defining a groove for receiving a raised flip chip of a flip chip processor thereby preventing the flip chip from being damaged during mounting the heat sink to the flip chip processor.
Another object of the present invention is to provide a heat sink readily mounted to a flip chip processor.
A further object of the present invention is to provide a heat sink for a flip chip processor prohibiting relative movement therebetween.
To achieve the above mentioned objects, a heat sink in accordance with the present invention comprises a base and a multiplicity of fins extending upward from a top face of the base. A groove is defined in a bottom face of the base opposite the fins for receiving a flip chip formed on a top face of a flip chip processor. At least one elongate protrusion extends from the base for engaging with an edge of a substrate of the flip chip processor to properly position the heat sink with respect to the flip chip processor.
Other objects, advantages and novel features of the present invention will be drawn from the following detailed embodiments of the present invention with attached drawings, in which:


REFERENCES:
patent: 5623394 (1997-04-01), Sherif et al.
patent: 5932925 (1997-08-01), McIntyre
patent: 5990552 (1997-02-01), Xie et al.
patent: 6046906 (1998-09-01), Tseng
patent: 6114761 (1998-01-01), Mertol et al.

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