Heat sink for electronic package

Details Heat sink for electronic package Heat sink for electronic package

1983-05-25

1985-10-08

Davie, James W.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 81, 357 82, 165 803, 165 804, 174 16HS, H01L 2336

Patent

active

045464057

ABSTRACT:
A cooling fin assembly for mounting on a semiconductor package that includes a plurality of pins adapted to be affixed to a surface on the package, and a cooling fin means having a thin walled cellular configuration with the cells defining elongated openings in side-by-side relation that extend through the fin means, the pins being seated in the cells of the fin means.

REFERENCES:
patent: 3030553 (1958-12-01), Communtzis
patent: 3198990 (1961-12-01), Katzin
patent: 4057101 (1977-11-01), Ruka et al.
patent: 4277816 (1981-07-01), Dunn
patent: 4296455 (1981-10-01), Leaycraft et al.
patent: 4338621 (1982-07-01), Braun
IBM TDB, vol. 23, No. 5, Oct. 1980, p. 1919.
Arnold et al., Heat Sink Design for Cooling Modules in a Forced Air Environment, Nov. 1979, IBM Corp. Technical Disclosure Bulletin, vol. 22, No. 6, pp. 2297-2298.

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