Heat sink for electronic device

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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Details

C361S704000

Reexamination Certificate

active

07137440

ABSTRACT:
A heat sink has a substrate with first pivoting portions thereon. A heat scattering member has a plurality of fins on a top thereof, a protrusion on a periphery thereof and a pressing portion between the protrusion and the distal fin. A clip member has connection portions, second pivoting portions and a lock portion. The second pivoting portions are projected from ends of the connection portions to be pivotally connected to the first pivoting portions of the substrate. The clip member is moved between a fist position and a second position. The lock portions are projected from the other ends of the connection portions to be engaged with the pressing portions while the lock portion is moved to the second position.

REFERENCES:
patent: 5099550 (1992-03-01), Beane et al.
patent: 5323845 (1994-06-01), Kin-shon
patent: 5448449 (1995-09-01), Bright et al.
patent: 5699229 (1997-12-01), Brownell
patent: 5774335 (1998-06-01), Pare et al.
patent: 5889653 (1999-03-01), Clemens et al.
patent: 6175499 (2001-01-01), Adams et al.
patent: 2003/0214787 (2003-11-01), Liu
patent: 2004/0066626 (2004-04-01), Lee et al.
patent: 2005/0174739 (2005-08-01), Chen et al.
patent: 2005/0225946 (2005-10-01), Fan et al.
patent: 2005/0263264 (2005-12-01), Chen et al.
patent: 2006/0027635 (2006-02-01), Schaenzer et al.

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