Heat sink for electronic circitry

Details Heat sink for electronic circitry Heat sink for electronic circitry

1990-10-19

1991-09-17

Prenty, Mark

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 80, 165 802, 174 521, H01L 2302, H01L 3902, F28F 700, H02G 308

Patent

active

050499815

ABSTRACT:
A thermally balanced electronic circuit having an element mounted on a suitable support base, a heat-sink having a bottom portion contacting the element and at least one flange projecting from the bottom portion, and a stress-balancing insert positioned on the bottom portion of the heat-sink and at least partially coextensive with the element, said bottom portion of the heat sink being secured to the element and to the insert by means of an adhesive. The insert is of a material having a coefficient of thermal expansion (TCE), .alpha..sub.1, different from the TCE, .alpha..sub.2, of material of the heat sink. The TCE of the material of the insert may be intermediate the material of the TCE of the heat sink and the TCE, .alpha..sub.3, of the material of the element. Preferably, the TCE of the material of the insert approximately matches or is equal to the TCE of the material of the element. The element, the bottom portion of the heat-sink, the insert and the adhesive layers form a balanced "sandwich" structure. Such a structure will exhibit planar thermal expansion equivalent to the outer skins of the sandwich structure, e.g. of the element and the insert. Expansion of the structure normal to the element and the insert accommodates the balance of the absolute volumetric change of components of the sandwich structure not accounted for in the skins.

REFERENCES:
patent: 4408220 (1983-10-01), Calabro

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