Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2008-03-25
2008-03-25
Walberg, Teresa J. (Department: 3744)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S080300, C361S697000, C361S700000
Reexamination Certificate
active
07347251
ABSTRACT:
A heat sink for distributing a thermal load is disclosed that includes two or more base plates connected and oriented around a central axis of the heat sink, at least one base plate receiving the thermal load, each base plate having thermal transport paths, the thermal transport paths oriented among the base plates so as to have the capability of accepting thermal transports having a plurality of lengths for thermal distribution between at least two base plates, heat-dissipating fins connected to each base plate, the heat-dissipating fins spaced apart in parallel and extending from each base plate towards the central axis of the heat sink, and a thermal transport connected between the base plate receiving the thermal load and at least one other base plate so as to distribute the thermal load among the base plates of the heat sink.
REFERENCES:
patent: 4682651 (1987-07-01), Gabuzda
patent: 5265321 (1993-11-01), Nelson et al.
patent: 5370178 (1994-12-01), Agonafer et al.
patent: 5936836 (1999-08-01), Scholder
patent: 6199624 (2001-03-01), Wotring
patent: 6394175 (2002-05-01), Chen et al.
patent: 6639799 (2003-10-01), Prasher et al.
patent: 6704199 (2004-03-01), Wiley
patent: 6712128 (2004-03-01), Dussinger et al.
patent: 6717813 (2004-04-01), Garner
patent: 6927979 (2005-08-01), Watanabe et al.
patent: 2004/0134642 (2004-07-01), Lo
patent: 2004/0226697 (2004-11-01), Liu
patent: 2006/0104032 (2006-05-01), Lee et al.
patent: 2007/0114009 (2007-05-01), Xia et al.
patent: 57042154 (1982-03-01), None
patent: 8306836 (1996-11-01), None
patent: 11118372 (1999-04-01), None
patent: 2002318084 (2002-10-01), None
patent: 2003115685 (2003-04-01), None
patent: 9400082 (1995-09-01), None
patent: WO03065775 (2003-08-01), None
Eldridge & Petersen; Heat-Pipe Vapor Cooling Etched Silicon Structure; IBM Technical Disclosure Bulletin; Jan. 1983; pp. 4118-4119; vol. 25 No. 8; USA.
Foster, Sr. Jimmy G.
Hardee Donna C.
Keener Don S.
Wolford Robert R.
Biggers & Ohanian LLP
Byrd Cynthia S.
Fortenberry Thomas D.
International Business Machines - Corporation
Walberg Teresa J.
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