Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2000-03-09
2001-06-05
Flanigan, Allen (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C361S704000
Reexamination Certificate
active
06241006
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates generally to a heat sink for a CPU (Central Processing Unit), and particularly to a heat sink that has a large heat dissipation area with excellent dissipation efficiency.
Subsequent to the fast development of the personal computer (PC), the related elements, such as hard disk drive (HDD), interface cards, and CPUs, have to deal with data more massively and more rapidly. This causes the temperature of the related elements are to soar internal quickly and heat sinks are required to lower down the temperature (particularly the chips) to maintain longevity of the elements.
An average heat sink is usually composed of a cooling fan and a plurality of heat-dissipation fin sets, wherein the cooling fan is used to blow air to dissipate heat through convection and radiation, and the heat dissipation efficiency is proportional to the area of the heat-dissipation fin sets.
From this point of view, the area of the plurality of heat-dissipation fin sets made of aluminum having an extruded or cast profile is more or less insufficient, wherein neither the dissipation fin sets of aluminum extrusion formed in a considerable thickness and intervals with a limited dissipation area, a larger wind resistance, and a slow airflow speed because of extrusion conditions, nor the aluminum cast dissipation fin sets with an insufficient dissipation area can dissipate heat efficiently despite a relatively smaller wind resistance.
A conventional heat sink shown in
FIG. 1
reveals that the heat sink A mainly contains a contact base A
1
, whereon a plurality of fin sets A
2
is are disposed, and a convection channel A
3
is provided between every two neighboring fin sets A
2
.
After being used for a long-term period, the conventional heat sink A has been found inefficient for the reason of insufficient dissipation area despite an additional fan being installed.
SUMMARY OF THE INVENTION
The primary object of this invention is to eliminate the abovesaid defect by using a welding technique to form a close contact between a plurality of heat-dissipation fin sets and a heat-conduction base so that the fin sets can contact the heat-conduction base face-to-face in order to obtain a better heat conduction effect.
Another object of this invention is to weld a plurality of upright fin sets on a heat-conduction base, wherein a height difference exists between the top edge of the plurality of fin sets and that of two lateral walls of the heat-conduction base to form a fan-installation space; and, a plurality of snap-joint openings are formed in the lateral walls of the heat-conduction base for stably fixing a cooling fan.
For more detailed information regarding this invention together with further advantages or features thereof, at least an example of preferred embodiment will be elucidated below with reference to the annexed drawings.
REFERENCES:
patent: 5381859 (1995-01-01), Minakami et al.
patent: 5494098 (1996-02-01), Morosas
patent: 5495392 (1996-02-01), Shen
patent: 6009937 (2000-01-01), Gonner et al.
patent: 6125921 (1999-03-01), Kuo
Bacon & Thomas PLLC
Flanigan Allen
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