Heat sink for an optical module

Details Heat sink for an optical module Heat sink for an optical module

2005-09-27

2005-09-27

Nguyen, Khiem (Department: 2839)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

Reexamination Certificate

active

06948861

ABSTRACT:
An optical module includes a base and a plurality of cooling fins mounted to the back surface of a printed wiring board used to support a number of opto-electronic devices. To optimize heat removal; the fins are mounted on the back surface in alignment with the opto-electronic devices mounted on the front surface. The module also includes a number of fiber-optic management features which are mounted on the wiring board or materially integrated with the base and cooling fins. By combining fiber-optic management features with a heat sink, on the opposite side of board-mounted opto-electronic components, the optical module achieves increased packaging density and functionality on a per volume basis compared with its conventional counterparts.

REFERENCES:
patent: 4691987 (1987-09-01), Ebner et al.
patent: 4763225 (1988-08-01), Frenkel et al.
patent: 5852257 (1998-12-01), Dittman et al.
patent: 6132104 (2000-10-01), Bliss et al.
patent: 6164837 (2000-12-01), Haake et al.
patent: 6172997 (2001-01-01), Miyake et al.

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