Heat sink for an electronic pin grid array

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing

Patent

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Details

24555, 248510, 257718, 361703, 361718, H05K 720

Patent

active

053047354

ABSTRACT:
A heat sink in adapted to be attached to a pin grid array comprising a pair of grooves extending along opposite sides into which grooves the tops of attachment clips are disposed. The heat sink has a pair of indentations on opposite sides of each clip holds each clip in place in the groove, the heat sink with the clips attached being positioned between two compression sections of a pair of attachment pliers and when a pin grid array is positioned adjacent to the heat sink, compression of the plier handles connects the clips to the pin grid array. Removal is accomplished by a pair of pliers having projecting points which fit beneath the clips so that compression of the plier handles forces the clip away from the pin grid array disconnecting it.

REFERENCES:
patent: 3617980 (1970-06-01), Alkire
patent: 4575038 (1986-03-01), Moore
patent: 4587595 (1986-05-01), Staples
patent: 4803545 (1989-02-01), Birkle
patent: 4814584 (1989-03-01), Bohlender et al.
patent: 4933746 (1990-06-01), King
patent: 5040096 (1991-08-01), Churchill
patent: 5099550 (1992-03-01), Beane
patent: 5170325 (1992-12-01), Bentz

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