Heat sink for a semiconductor device

Details Heat sink for a semiconductor device Heat sink for a semiconductor device

1984-06-12

1985-08-13

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 80B, 174 16HS, H05K 720

Patent

active

045353840

ABSTRACT:
A semiconductor device comprising at least one heat sink joined to a plurality of IC packages mounted on a mother board. Plural individual heat sinks are joined to respectively corresponding IC packages each comprising a central shaft joined to and extending in substantially perpendicular relationship from a respective said package and plural, parallel spaced fins extending outwardly from and in perpendicular relationship to the shaft. A common heat sink for plural IC packages comprises a base board portion, a heat conducting shaft portion arranged perpendicular to the base board portion and a plurality of heat dissipating fins arranged perpendicular to said heat conducting shaft portion and in parallel, spaced relationship to each other, the common heat sink having one or more slits which are formed parallel to and extending through the heat conducting shaft from the base board portion to midway of the height of the heat conducting shaft and defining a plurality of sections of the base board portion, respectively, joined to the plurality of IC packages.

REFERENCES:
patent: 3435891 (1969-04-01), Parrish
patent: 4246597 (1981-01-01), Cole
patent: 4292647 (1981-09-01), Lee
IBM Tech. Disl. Bulletin, vol. 21, No. 9, Feb. 1979, Ng, p. 3591, Circuit Module Package.
IBM Tech. Discl. Bulletin, vol. 11, No. 10, Mar. 1969, Bryden, p. 1323, Heat Sink.

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