Heat sink for a circuit device

Details Heat sink for a circuit device Heat sink for a circuit device

2011-03-22

2011-03-22

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S121000, C361S695000, C361S703000

Reexamination Certificate

active

07911791

ABSTRACT:
Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a heat sink in thermal contact with the circuit device wherein the heat sink includes a base member in thermal contact with the circuit device, a first shell coupled to the base member that includes a first inclined internal surface, a lower end and first plurality of orifices at the lower end to enable a fluid to transit the first shell, and at least one additional shell coupled to the base member and nested within the first shell. The at least one additional shell includes a second inclined internal surface and a second plurality of orifices to enable the fluid to transit the at least one additional shell. The fluid is moved through the first shell and the at least one additional shell.

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