Heat sink fixing assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080200, C165S104330, C165S185000, C361S700000, C257S718000, C257S719000

Reexamination Certificate

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07436673

ABSTRACT:
A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.

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patent: 7310226 (2007-12-01), Chen et al.
patent: 2005/0117307 (2005-06-01), Tanaka
patent: 2007/0236887 (2007-10-01), Cheng et al.
patent: 2008/0013285 (2008-01-01), Hung

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