Heat sink element coupling structure (2)

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S185000, C361S709000, C361S704000, C174S016300

Reexamination Certificate

active

07025122

ABSTRACT:
A heat sink element coupling structure comprised of a “+” or a “+”-shaped horizontal offset disposed on the upper and lower or left and right two sides or a certain position on the lateral edge at the center portion of an L-shaped or a horizontally oriented U-shaped heat sink unit (element) plate. The structure includes inverted U-shaped or U-shaped appendages situated at the anterior section of the horizontal offsets as well as one or two wing-shaped lock tabs formed at the two sides or either the left or the right side of the inverted U-shaped or U-shaped appendages. Also included in the structure are one or two cutaways at the two sides or either the left or the right side of the horizontal offsets and a downward or upward lock tab at the two sides or the either left or right of the anterior edge of the horizontal offsets. The wing-shaped lock tabs or lock tabs of each coupling structure at the two sides of one heat sink unit (element) are fitted onto the horizontal offsets of the next correspondingly situated heat sink unit (element) such that the one or two wing-shaped lock tabs or lock tabs on the front heat sink unit (element) become engaged onto the lateral edge of the adjacent other heat sink unit (element), the horizontal offsets at the two lateral edges of the its plate or the cutaway at one side, thereby enabling several or numerous heat sink elements to be interconnected at fixed horizontal distances and positions.

REFERENCES:
patent: 6336498 (2002-01-01), Wei
patent: 6340056 (2002-01-01), Huang et al.
patent: 6386275 (2002-05-01), Kuo et al.
patent: 6401810 (2002-06-01), Kuo et al.
patent: 6449160 (2002-09-01), Tsai
patent: 6474407 (2002-11-01), Chang et al.
patent: 6607023 (2003-08-01), Ho et al.
patent: 6607028 (2003-08-01), Wang et al.
patent: 6619381 (2003-09-01), Lee
patent: 6639802 (2003-10-01), Dong et al.
patent: 6644386 (2003-11-01), Hsu
patent: 6644397 (2003-11-01), Shen
patent: 6651733 (2003-11-01), Horng et al.
patent: 6655448 (2003-12-01), Lin
patent: 6672379 (2004-01-01), Wang et al.
patent: 6729384 (2004-05-01), Lo
patent: 6729385 (2004-05-01), Huang et al.
patent: 6754079 (2004-06-01), Chang
patent: 6765799 (2004-07-01), Huang
patent: 2004/0040700 (2004-03-01), Tsai et al.
patent: 2004/0069479 (2004-04-01), Yeh
patent: 2004/0150955 (2004-08-01), You-Tien
patent: 2004/0182543 (2004-09-01), Shao
patent: 2005/0094375 (2005-05-01), Chiang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat sink element coupling structure (2) does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink element coupling structure (2), we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink element coupling structure (2) will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3551415

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.