Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-05-16
2008-10-21
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S715000, C361S719000, C165S080300, C165S185000
Reexamination Certificate
active
07440282
ABSTRACT:
An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a thermally conductive heat sink assembled over the electronic device. The heat sink includes compliant pedestals each having a contact surface for contacting a surface of an electronic device to conduct thermal energy away from the electronic device. The package is held together such that the heat sink is in contact with the surface of an electronic device such that each compliant pedestal applies a compressive force to the surface of the electronic device.
REFERENCES:
patent: 4899256 (1990-02-01), Sway-Tin
patent: 5402313 (1995-03-01), Casperson et al.
patent: 5777844 (1998-07-01), Kiefer
patent: 5808868 (1998-09-01), Drekmeier
patent: 5812375 (1998-09-01), Casperson
patent: 5914531 (1999-06-01), Tsunoda et al.
patent: 6025991 (2000-02-01), Saito
patent: 6180436 (2001-01-01), Koors et al.
patent: 6185100 (2001-02-01), Bentz et al.
patent: 7050305 (2006-05-01), Thorum
patent: 7251133 (2007-07-01), Wallace
patent: 2005/0078456 (2005-04-01), Mandel et al.
patent: 2006/0113680 (2006-06-01), DiStefano
patent: 2006/0274512 (2006-12-01), Brandenburg et al.
patent: 2006/0281230 (2006-12-01), Brandenburg et al.
Brandenburg Scott D.
Chengalva Suresh K.
Zimmerman David W.
Delphi Technologies Inc.
Funke Jimmy L.
Gandhi Jayprakash N
Smith Courtney L
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