Heat sink device or surface mount type component mounted on a pr

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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174 35R, 357 81, 361388, 361424, H05K 720

Patent

active

050500384

ABSTRACT:
A device for dissipating heat for a surface mount component assembled onto a printed circuit board is made up by a metallic plate deposited on the rear of the substrate under the surface mount component. A thermal coupling device is made up by a small heat collecting plate provided on the front side of the substrate and the actual substrate. The heat collecting plate also performs an electro-magnetic shielding function and is advantageously constituted either by the shielding plate normally provided for this purpose or by an extension thereof.

REFERENCES:
patent: 4254447 (1981-03-01), Griffis
patent: 4945451 (1990-07-01), Gohl et al.
IBM Technical Disclosure Bulletin, vol. 28, No. 11, Apr. 1986, pp 4723-4725; "Stiffened Card with Integrated Circuit".

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