Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2000-03-28
2001-07-10
Lazarus, Ira S. (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S104330, C174S015100, C257S714000, C361S699000, C361S709000
Reexamination Certificate
active
06257320
ABSTRACT:
The present invention relates to a fluid cooled heat sink device for use with a semiconductor devices particularly in high power systems. As shown in the instant specification, the cooling device is applied to a high powered, flat base insulated gate bipolar transistor (IGBT) module, but is not limited to this component or package type.
It is necessary to efficiently remove heat in order to limit temperature rise, to achieve the maximum current carrying and switching capability in high power semiconductor devices. This is particularly true in ultra high power systems where individual semiconductor devices must dissipate upwards to 1500-4000 watts and more without overheating.
Moreover, it is highly desirable to accomplish this in a simple, convenient and expeditious manner suitable for efficiently cooling such ultra high power systems without the use of massive cooling devices.
It is therefore a principal object of the present invention to provide a fluid cooled heat sink device suitable for use with power semiconductors.
It is a further object of the present invention to provide a device as aforesaid which is suitable for use in ultra high power systems where individual semiconductor devices must dissipate upwards of 1500-4000 watts and more without overheating.
It is a still further object of the present invention to provide a device as aforesaid which accomplishes the foregoing in a simple, convenient and expeditious manner without the use of massive cooling devices.
Further objects and advantages of the present invention will appear hereinbelow.
SUMMARY OF THE INVENTION
In accordance with the present invention, it has been found that the foregoing objects and advantages are readily obtained.
The present invention provides a fluid cooled heat sink device suitable for use with a semiconductor, which comprises: a heat sink member having a plurality of interior walls defining a plurality of passageways for a cooling fluid; said heat sink member having a heat exchange surface and said passageways defining a plurality of channel areas in heat exchange relationship with said surface; wherein said passageways define a plurality of paths for cooling fluid with wide channel areas adjacent said surface; and means for introducing cooling fluid into said passageways.
Desirably, the passageways define a plurality of tortuous paths, and desirably the heat sink member has an essentially flat heat exchange surface.
In the preferred embodiment, the heat sink member includes a plurality of overlapping pockets with channel areas adjacent said surface. The pockets may, for example, be essentially round, square, oval, triangular, rectangular, etc. Also, preferably the overlapping areas represent only a portion of the diameter of the channel areas.
In a preferred embodiment, means are provided to create turbulent flow in the passageways. For example, the overlapping areas represent narrow passageways which cause cooling fluid to impinge on the channel and wall areas with turbulence.
Further features of and advantages of the present invention will appear hereinbelow.
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Bachman & LaPointe P.C.
Lazarus Ira S.
McKinnon Terrell
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