Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-11-12
2001-08-07
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Reexamination Certificate
active
06272014
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a heat sink device and, more particularly, to a heat sink device used on a chip.
Recent developments in the computer industry have resulted in an increase in the speed of electronic chips accompanied by a sharp increase in heat generated by the chip. A heat dissipation method is a necessity. A heat sink device mounted on the chip is one method used to cool a chip and to assure normal chip operation.
A conventional heat sink device as disclosed in U.S. Pat. No. 5,384,940 is shown in FIG.
5
. The heat sink device
2
comprises a heat sink
110
, a pair of fixing bolts
120
and a pair of springs
130
. The heat sink
110
includes a base and a plurality of fins upwardly depending therefrom, the base defining holes for receiving the fixing bolts
120
. Each fixing bolt
120
includes a cap
122
, a beam
124
and a latch
126
. The diameter of each beam
124
corresponds to the diameter of each hole (not shown) in the heat sink
110
and is smaller than the diameter of each cap
122
and each latch
126
respectively. The springs
130
encircle the beams
124
of the fixing bolts
120
. During assembly, the fixing bolts
120
protrude though the corresponding holes (not shown) of the heat sink
110
and the printed circuit board (not shown). The latches
126
press against the bottom surface of the printed circuit board. The heat sink
110
presses against the chip with a resilient force, which resilient force is provided by the springs
130
. However, the limited resilient force provided by the springs
130
can not meet the requirements for tightly attaching the heat sink
110
to the chip. Moreover, the fixing bolts
120
are mounted between the closely arrayed fins, making installation inconvenient. U.S. Pat. No. 5,943,210 having the same assignee with the invention also discloses another type heat sink device for use with the CPU.
BRIEF SUMMARY OF THE INVENTION
A main object of the present invention is to provide a heat sink device used to cool a chip.
Another object of the present invention is to provide a heat sink device which is more convenient to install and which provides a greater resilient force for pressing against an electronic chip.
A heat sink device of the present invention comprises a heat sink, a pair of mounting portions and a pair of fixing bolts. The heat sink comprises a base forming a plurality of fins and a pair of tabs extending from opposite corners of the base. Each tab has a circular hole. Each mounting portion is unitarily formed and includes a main body, a resilient arm upwardly and inwardly extending from an end of the main body and a pair of clamping portions depending from opposite edges of the main body. The mounting portions are respectively secured to each tab, the main bodies being attached to the tabs. A circular aperture is defined in each main body, while an oval opening is defined in each resilient arm. Each fixing bolt includes a cap, a beam and a latch.
In assembly, each heat sink is attached against a chip on a printed circuit board by means of the fixing bolts attaching the heat sink and mounting portions to the printed circuit board, the resilient arms of the mounting portions providing a resilient force pressing the heat sink to the chip.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
REFERENCES:
patent: 5730210 (1998-03-01), Kou
patent: 5999402 (1999-12-01), Jeffries et al.
patent: 6112378 (2000-09-01), Lee
Chung Wei Te
Foxconn Precison Components Co., Ltd.
Thompson Gregory
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