Heat sink device assembly for encumbered IC package

Details Heat sink device assembly for encumbered IC package Heat sink device assembly for encumbered IC package

1987-02-13

1988-03-22

Kucia, R. R.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 16HS, 165 803, 165185, 361383, H05K 720

Patent

active

047332930

ABSTRACT:
A heat sink device assembly providing a radially finned heat sink with a tapered base is provided for application to surface-encumbered integrated circuit packages for heat dissipation purposes. The device involves a patterned set of radial fin elements, through which cooling air flow may pass, mounted on a baseplate. A taper or reduction in cross sectional area of the baseplate is provided in order to maximize the surface area for heat dissipation while constraining the area of attachment, thus avoiding physical or electrical contact with peripheral objects or areas placed on the surface edges of the integrated circuit package.

REFERENCES:
patent: 3313339 (1967-04-01), Coe
patent: 4587595 (1986-05-01), Staples
patent: 4682651 (1987-07-01), Gabuzda
Aham catalog, Heat Sinks Coolers, published by Aham of Rancho, Calif., Jun. 1, 1977, p. 13.

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