Heat sink device

Details Heat sink device Heat sink device

1996-11-06

1999-03-23

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165185, 174 163, 257718, 361690, H05K 720

Patent

active

058868704

ABSTRACT:
A heat sink apparatus including a heat conducting plate which is in contact with an IC device to conduct heat generated in the IC device, cooling fins which are mounted at a center section of the heat conducting plate to radiate the generated heat conducted, and protection pins which are mounted on a periphery of the heat conducting plate to protect the cooling fins. The heat sink apparatus has improved reliability and safety during handling.

REFERENCES:
patent: 5673177 (1997-09-01), Brodsky et al.

Affiliated with

Also associated with

Rating

Heat sink device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2132305