Heat sink conduction between disk drive carrier and information

Details Heat sink conduction between disk drive carrier and information Heat sink conduction between disk drive carrier and information

1998-06-29

2000-10-31

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361687, 361727, G06F 116

Patent

active

061412112

ABSTRACT:
A mass storage system includes data storage modules having fins extending therefrom and further includes an enclosure having guides for slidably receiving the fins of the data storage modules into the enclosure and for enabling a coupled position of the data storage modules within the enclosure. A generally contacting fit is formed between the fins and guides for conducting heat from the data storage modules to the enclosure when the modules are disposed in the coupled position within the enclosure. In a preferred embodiment, the data storage modules include high performance disk drives disposed within carrier housings. The guides act as rail guides for slidably receiving the modules into the enclosure and for enabling electrical connection between the disk drives and the enclosure in the coupled position. The guides and firs are formed to maximize surface area contact therebetween when the drives are in the coupled position. In an alternate embodiment, the data storage modules are positionally biased within the enclosure when in the coupled position for improved surface area contact between the modules and the enclosure.

REFERENCES:
patent: 5828546 (1998-10-01), Tirrell et al.
Cheetah Family of Products; "10,000 RPM Drive Cooling and Power White Paper"; by Seagate (The Data Technology Company); pp.: 1, 7, 13, 15, 16.

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