Heat sink conduction apparatus

Details Heat sink conduction apparatus Heat sink conduction apparatus

2007-10-02

2007-10-02

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C257S719000, C361S704000, C361S710000

Reexamination Certificate

active

11103308

ABSTRACT:
A heat sink conduction apparatus is disclosed. The heat sink conduction apparatus is utilized in the heat sink assembly of an electronic device to thermal conduct with a heat source component. The apparatus comprises a thermal pad and a clip. The side of the thermal pad, where is connected with the heat source component, has at least one buckle pillar and one screw pillar. The clip includes a pair of spring plates and a pair of beams; each of the spring plate corresponding to each of the buckle pillar has a buckle and corresponding to each of the screw pillar has a screwed hole. The thermal pad supported a clip by the buckle pillar and the screw pillar, via the connection of the clip with the buckle pillar and the screw pillar, the heat source component can be fixed and make the surface of the heat source component to connect with the thermal pad in heat conductive manner.

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