Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-08-28
2007-08-28
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S718000, C257S719000, C165S080300, C165S185000, C361S710000, C361S719000
Reexamination Certificate
active
11012422
ABSTRACT:
A heat sink clip assembly is for attaching a heat sink (10) to a motherboard (60). The motherboard and the heat sink each respectively define through apertures (52) and through holes (16) therein. The heat sink clip assembly includes four sleeves (46), four posts (38), four fasteners (41), and four spring members (44). Each sleeve comprises a top section and a bottom section. The top sections of the sleeves engage in the through holes respectively to attach the sleeves to the heat sink. The posts extend through the through apertures and received in the bottom sections of the sleeves. Each fastener includes a top head and a bottom end, the bottom ends extend into the sleeves and coupled to the top portions of the posts. The spring members are compressed between the top heads of the fasteners and the heat sink urging the heat sink toward the motherboard.
REFERENCES:
patent: 6307748 (2001-10-01), Lin et al.
patent: 6545879 (2003-04-01), Goodwin
patent: 6611431 (2003-08-01), Lee et al.
patent: 6859367 (2005-02-01), Davison
patent: 2004/0047130 (2004-03-01), Liu
Chen Yong-Dong
Lee Hsieh-Kun
Lu Cui-Jun
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shenzhen) Co., Ltd.
Morris Manning & Martin LLP
Thompson Gregory
Tingkang Xia, Esq. Tim
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