Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-12-15
2002-11-05
Schuberg, Darren (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S702000, C361S707000, C257S707000, C165S080300
Reexamination Certificate
active
06477048
ABSTRACT:
BACKGROUND
1. Field of the Invention
The present invention relates to a clip and particularly to a clip for a heat sink which readily attaches the heat sink to an electronic device.
2. The Related Art
Certain electronic devices, such as Central Processing Units (CPU), generate a large amount of heat during operation, which deteriorates their operating stability. To counter this problem, a heat sink is often mounted to a CPU for dissipating heat therefrom. Various clips have been used for attaching a heat sink to a CPU.
FIG. 1
shows a conventional clip
1
for attaching a heat sink
7
to a CPU
8
which is attached to a socket
9
. The clip
1
comprises an pressing portion
2
for pressing against the heat sink
7
and a pair of spring portions
3
extending from opposite ends of the pressing portion
2
. A pair of legs
4
extends downwards from the spring portions
3
. Each leg
4
defines two apertures
5
,
6
arranged one above the other. The lower apertures
5
receive corresponding catches
11
formed on the socket
9
for closely attaching the heat sink
7
and the CPU
8
to the socket
9
. The upper apertures
6
are used to engage with a tool, such as a screwdriver, for engaging or disengaging the lower apertures
5
with or from the catches
11
. However, the procedure for assembling/disassembly the heat sink
7
to/from the CPU
8
using the clip
1
is cumbersome and complicated. This is especially so since the assembly/disassembly can not be performed without a tool.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a clip for a heat sink having an operation portion which readily attaches/detaches the heat sink to/from an electronic device.
Another object of the present invention is to provide a clip for securely attaching a heat sink to an electronic device.
To achieve the above-mentioned objects, a heat sink clip is formed from a single piece of resilient metal by stamping, and comprises an operation portion, a pressing body, and a first and second arms extending from opposite ends of the pressing body. The first and second arms each defmes an aperture for engaging with a catch on a socket on which an electronic device is mounted. The pressing body is adapted to press a heat sink onto the electronic device. The operation portion extends from an end of the pressing body for readily engaging/disengaging the clip.
Other objects, advantages and novel features of the present invention will be drawn from the following detailed embodiment of the present invention with attached drawings, in which:
REFERENCES:
patent: 5486981 (1996-01-01), Blomquist
patent: 5602719 (1997-02-01), Kinion
patent: 5671118 (1997-09-01), Blomquist
patent: 5953212 (1999-09-01), Lee
patent: 6108207 (2000-08-01), Lee
patent: 6111752 (2000-08-01), Huang et al.
patent: 6118661 (2000-09-01), Lo
patent: 6158707 (2000-12-01), Chien
patent: 6256846 (2001-07-01), Lee
patent: 6272722 (2001-08-01), Lai
patent: 6304457 (2001-10-01), Liu et al.
patent: 02000183578 (2000-06-01), None
Huang Ai-Min
Lee Hsieh Kun
Datskovsky Michael
Schuberg Darren
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