Heat sink chip package and method of making

Details Heat sink chip package and method of making Heat sink chip package and method of making

1999-07-30

2000-09-19

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361709, 361717, 361719, 257706, 257707, 257712, 257680, 257723, 257778, 165 802, 165185, H05K 720

Patent

active

061221716

ABSTRACT:
The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechanical expansion between the PCB and the ball array.

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