Heat sink capable of having a fan mounted aslant to the...

Details Heat sink capable of having a fan mounted aslant to the... Heat sink capable of having a fan mounted aslant to the...

2001-01-15

2002-12-31

Schuberg, Darren (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S695000, C257S719000, C165S121000

Reexamination Certificate

active

06501651

ABSTRACT:

REFERENCE TO RELATED APPLICATION
The present application claims priority from Taiwan Application No. 089113711, entitled “Heat Sink Capable of Having a Fan Mounted Aslant to the Lateral Side Thereof,” filed on Jul. 6, 2000.
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a heat sink for a computer chip, such as a Central Processing Unit (CPU) chip, and more particularly to a heat sink where a fan is mounted aslant to the lateral side thereof.
2. Description of the Related Art
As the function and complexity of computer chips have increased recently, the heat generated by computer chips has also increased. Additionally, the heat dissipation space of computer chips has become smaller and smaller since the information products emphasize small sizes and high clock rates. Therefore, how to effectively dissipate the heat in a limited space to maintain the performance of the computer chips becomes an important issue.
FIG. 1
is a schematic diagram of a prior art heat sink
10
mounted on a CPU chip
12
. The heat sink
10
comprises a base
20
, a heat dissipation unit
22
and a fan
24
. The heat dissipation unit
22
, having a plurality of heat dissipation fins
23
, is mounted on the base
20
. The fan
24
is mounted on the heat dissipation unit
22
. In an exemplary computer server, the total height H of a housing
14
above a motherboard
16
is only 44.86 mm. Thus, after positioning a CPU slot
18
and the CPU chip
12
on the motherboard
16
, only a height h of 27 mm is available for mounting the heat sink
10
. As shown in
FIG. 1
, the fan
24
is so close to the upper cover of the housing
14
that the air entry area
26
is too small and the space for heat dissipation is limited. Therefore, the quantity of the air that can enter the fan
24
is quite small or close to zero. The low air flow causes the fan
24
to run idle, and no air is swept into the heat dissipation unit
22
. Thus, the air from the fan
24
can not take the heat generated by the CPU
12
chip away, and the fan
24
can not effectively dissipate the heat from the CPU chip
12
.
In addition, since the fan
24
is mounted on the heat dissipation unit
22
, the location of the fan axis will cause the central area of the heat dissipation unit
22
to have little or no air flow or to have turbulent air flow. These phenomena cause the temperature in the central area of the heat dissipation unit
22
to be quite high. Since the CPU chip
12
is located under the heat dissipation unit
22
, the effect of heat dissipation is greatly reduced.
SUMMARY OF THE INVENTION
One aspect of the present invention is to provide a heat sink where a fan is mounted aslant to the lateral side of the heat sink. The heat sink of the present invention not only enlarges the air entry area of the fan, but also can effectively sweep the air into the central area of a heat dissipation unit to achieve an improved heat dissipation effect.
The foregoing is a brief description of some deficiencies in the prior art and advantages of this invention. Other features, advantages and embodiments of the invention will be apparent to those skilled in the art from the following description, accompanying drawings and appended claims.


REFERENCES:
patent: 5353863 (1994-10-01), Yu et al.
patent: 5440450 (1995-08-01), Lau et al.
patent: 5491610 (1996-02-01), Mok et al.
patent: 5563768 (1996-10-01), Perdue
patent: 5810072 (1998-09-01), Rees et al.
patent: 6094346 (2000-07-01), Schweers et al.
patent: 6269002 (2001-07-01), Azar
patent: 407014954 (1995-01-01), None
patent: 409307034 (1997-11-01), None

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