Heat sink attachment device

Details Heat sink attachment device Heat sink attachment device

2005-02-22

2005-02-22

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C257S719000, C257S726000, C361S707000, C361S710000, C361S719000, C361S720000

Reexamination Certificate

active

06859367

ABSTRACT:
Heat sink attachment components are provided comprising retention bolts with a coil spring captured between the head of the retention bolt and a retention lock flange of a retention lock. A portion of each retention bolt shaft is retained and in frictional engagement with socket bores of a mounting socket. A moderate interference fit between the retention lock and the retention bolt prevents unintended decoupling. While engaged, the compressed coil spring urges against the retention lock flange, with the retention lock flange in urging engagement with the heat dissipation side of a heat sink base, with the heat sink base in urging engagement with thermal interface material on the top of the microelectronic package. The urging engagement of the coil springs provide a constant bias for urging engagement between the components.

REFERENCES:
patent: 5757621 (1998-05-01), Patel
patent: 5880930 (1999-03-01), Wheaton
patent: 5901039 (1999-05-01), Dehaine et al.
patent: 6307748 (2001-10-01), Lin et al.
patent: 6404632 (2002-06-01), Forkas
patent: 6480387 (2002-11-01), Lee et al.
patent: 6556490 (2003-04-01), Shubat et al.
patent: 6680848 (2004-01-01), Petit et al.

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