Heat sink attachment

Details Heat sink attachment Heat sink attachment

2006-07-04

2006-07-04

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S709000, C359S634000, C353S060000, C353S119000, C349S161000, C315S032000

Reexamination Certificate

active

07072184

ABSTRACT:
A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket mounting screws. A spring clip (202) presses a thermal stud (204) against the back of an electrical device package (206). The present invention is especially useful for attaching a spatial light modulator to a printed circuit board (106) since it provides a simple, reliable heat sink without blocking the light path to and from the device. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

REFERENCES:
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patent: 5940271 (1999-08-01), Mertol
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patent: 6720206 (2004-04-01), Choi
patent: 6775991 (2004-08-01), Evans et al.
patent: 6814445 (2004-11-01), Kalyandurg et al.
An Article: “Microcircuit Heat Sink”, IBM Technical Disclosure Bulletin, Mar. 1, 1966, p. 1457, vol. 8, Issue 10, United States.

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