Heat sink assembly with temperature display

Details Heat sink assembly with temperature display Heat sink assembly with temperature display

2011-06-28

2011-06-28

Hoffberg, Robert J (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679540, C361S704000, C361S709000, C324S762020, C374S141000, C374S170000

Reexamination Certificate

active

07969743

ABSTRACT:
A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog signals and converts the analog signals into digital signals, and then displays the digital signals with temperature unit symbol.

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patent: 6209623 (2001-04-01), Tantoush
patent: 6577146 (2003-06-01), Gamache et al.
patent: 7549790 (2009-06-01), Ye et al.
patent: 7578614 (2009-08-01), Chen et al.
patent: 2008/0130705 (2008-06-01), Chen et al.
patent: 2010/0103624 (2010-04-01), Chen et al.

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