Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-06-21
2005-06-21
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S695000, C361S699000, C361S719000, C257S715000, C257S722000, C174S015200, C165S080300, C165S080400, C165S104210, C165S104330
Reexamination Certificate
active
06909608
ABSTRACT:
The present invention provides a heat sink assembly. The heat sink assembly comprises a first heat sink with a fan disposed therein, a second heat sink and a heat pipe. The heat pipe has two ends respectively being disposed inside the first heat sink and the second heat sink, The heat pipe is disposed in a side of the first heat sink and the second heat sink and connects the first heat sink and the second heat sink with a space therein for positioning the fan. Therefore, the first heat sink and the second heat sink become a main heat-dissipating region and a sub heat-dissipating region. Heat is dissipated first in the first heat sink (the main heat-dissipating region) and then transferred via the heat pipe to the second heat sink (the sub heat-dissipating region) for being dissipated again.
REFERENCES:
patent: 6189610 (2001-02-01), LaClare et al.
patent: 6263957 (2001-07-01), Chen et al.
patent: 6288896 (2001-09-01), Hsu
patent: 6360814 (2002-03-01), Tanaka et al.
patent: 6394175 (2002-05-01), Chen et al.
patent: 6410982 (2002-06-01), Brownell et al.
patent: 6459584 (2002-10-01), Kuo
patent: 6598667 (2003-07-01), Kuo
patent: 6600649 (2003-07-01), Tsai et al.
patent: 6651734 (2003-11-01), Liu
patent: 6745824 (2004-06-01), Lee et al.
patent: 2003/0140636 (2003-07-01), Van Winkle
patent: 2004/0037039 (2004-02-01), Shimura et al.
patent: 505379 (1990-11-01), None
patent: 504132 (1990-12-01), None
Chervinsky Boris
Datech Technology Co., Ltd.
Troxell Law Office PLLC
LandOfFree
Heat sink assembly with heat pipe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink assembly with heat pipe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink assembly with heat pipe will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3460433