Heat sink assembly having interdigitated cooling fins

Details Heat sink assembly having interdigitated cooling fins Heat sink assembly having interdigitated cooling fins

2011-03-15

2011-03-15

Hoffberg, Robert J (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679540, C361S704000, C361S709000, C361S716000, C165S080300, C165S185000

Reexamination Certificate

active

07907411

ABSTRACT:
A heat sink assembly including a first heat sink sub-assembly in thermal contact with a first heat source and including spaced apart columns of spaced horizontal fins extending outwardly from the first heat source, and a second heat sink sub-assembly in thermal contact with a second heat source and including spaced apart rows of space vertical fins extending outwardly from the second heat source, wherein the spaced apart columns of spaced horizontal and the spaced apart rows of spaced vertical fins are arranged in an interdigitated manner.

REFERENCES:
patent: 4557225 (1985-12-01), Sagues et al.
patent: 5930113 (1999-07-01), McCann
patent: 6735082 (2004-05-01), Self
patent: 7082032 (2006-07-01), Barsun et al.
patent: 7333332 (2008-02-01), Wang
patent: 7447020 (2008-11-01), Xia et al.
patent: 7515412 (2009-04-01), Lee

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