Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-06-30
2011-12-20
Smith, Courtney (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S707000, C361S709000, C361S719000, C165S080300, C165S185000
Reexamination Certificate
active
08081477
ABSTRACT:
A heat sink assembly includes a heat sink adapted for thermally contacting an electronic component of a printed circuit board, and a clip pressing the heat sink and engaging with the printed circuit board. The clip includes a pressing portion pressing the heat sink, two arms extending slantwise and upwardly from opposite ends of the pressing portion, two connecting portions extending outwardly from the two arms, two securing portions engaging with the printed circuit board, and two operating portions. When the two operating portion are operated, the connecting portions are rotated and the securing portions rotate with the connecting portions to engage with the printed circuit board.
REFERENCES:
patent: 6510054 (2003-01-01), Chen
patent: 6822869 (2004-11-01), Huang et al.
patent: 7203066 (2007-04-01), Lee et al.
patent: 7382622 (2008-06-01), Li et al.
patent: 2003/0015343 (2003-01-01), Chen
patent: 2010/0002396 (2010-01-01), He et al.
Liu Heng
Yang Jian
Altis Law Group, Inc.
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Smith Courtney
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