Heat sink assembly for multiple electronic components

Details Heat sink assembly for multiple electronic components Heat sink assembly for multiple electronic components

2007-12-27

2010-02-23

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

07667970

ABSTRACT:
A heat sink assembly for removing heat from two heat generating-components mounted on a printed circuit board, includes a first heat sink, a second heat sink, a plurality of poles each having a head at a top end and a double-layer spring. The first heat sink includes a base and a plurality of fins arranged on the base. The second heat sink has a first shoulder extending from a lateral side thereof. The first shoulder is disposed on the base. The double-layer spring includes an outer spring and an inner spring having a top end connected to a top end of the outer spring. One of the poles wearing the double-layer spring extends through the first shoulder and the base. The outer spring is compressed between the head of the pole and the first shoulder. The inner spring is compressed between the head of the pole and the base.

REFERENCES:
patent: 6343643 (2002-02-01), Bollesen
patent: 6490161 (2002-12-01), Johnson
patent: 6680848 (2004-01-01), Petit et al.
patent: 7428154 (2008-09-01), Ishimine et al.

Affiliated with

Also associated with

Rating

Heat sink assembly for multiple electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink assembly for multiple electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink assembly for multiple electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4174991