Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-01-30
2007-01-30
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Reexamination Certificate
active
10626993
ABSTRACT:
The heat sink assembly includes a heat sink member with a body portion and an upper mounting portion. The heat sink member is connected to an integrated circuit on a printed circuit board assembly. A resilient mounting assembly is positioned on the mounting portion of the heat sink assembly and is constructed and arranged to permit the heat sink assembly to be removably mounted on the mounting member, which in turn is attachable to or part of the chassis of the electronic equipment. The mounting assembly includes a bias element, such as a spring, for holding the heat sink assembly and the mounting member together in a low thermal resistance relationship.
REFERENCES:
patent: 4546408 (1985-10-01), Rodseth et al.
patent: 5339215 (1994-08-01), Nishiguchi
patent: 6140591 (2000-10-01), Osborne et al.
patent: 6331937 (2001-12-01), Bartyzel
patent: 6501658 (2002-12-01), Pearson et al.
Carpio Ivan
Cook Alex McFarron Manzo Cummings & Mebler, Ltd.
Schweltzer Engineering Laboratories, Inc.
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