Heat-sink assembly for high-power stud-mounted semiconductor dev

Details Heat-sink assembly for high-power stud-mounted semiconductor dev Heat-sink assembly for high-power stud-mounted semiconductor dev

1975-05-12

1977-01-18

Tolin, Gerald P.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 81, 174 52FP, H01L 2340

Patent

active

040041956

ABSTRACT:
A heat-sink assembly adapted for use with a high-power stud-mounted semiconductor device comprises a heat-dispersing arm having one end securely attached to a circuit board and the other end shaped for semipermanent connection and thermal coupling to a heat-conductive stud. The arm is sufficiently bendable to allow displacement thereof from above the surface of the device mounted on the circuit board for removal of the device from the circuit board after disconnecting the other end from the stud while keeping the one end securely attached to the circuit board. The heat-sink assembly may further comprise means for semipermanently connecting the other end of the arm to the stud and retaining the other end in intimate thermal contact therewith.

REFERENCES:
patent: 2701866 (1955-02-01), Chapman
patent: 2826385 (1958-03-01), Osborn
patent: 3211822 (1965-10-01), Krall
patent: 3237905 (1966-03-01), Baker
patent: 3257621 (1966-06-01), Jadoul
patent: 3259813 (1966-07-01), Linstrand
patent: 3271722 (1966-09-01), Garstang
patent: 3522491 (1970-08-01), Coe
patent: 3665256 (1972-05-01), Goun
patent: 3711752 (1973-01-01), Nier
patent: 3836825 (1974-09-01), Hall

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