Heat sink assembly for electrical components

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361688, 361690, 361707, 361711, 361714, 165 803, H05K 720, H05K 712

Patent

active

060439815

ABSTRACT:
A heat sink assembly to remove heat from electrical components mounted on a circuit board is disclosed. The assembly contains a housing that is formed from a suitable heat sinking material and is appropriate for receiving a circuit board with surface mounted electrical components. The invention provides an improved apparatus for establishing thermal contact from a heat generating, surface mounted electrical component to the housing. A resilient biasing element is fixed in relation to the circuit board and the housing in order to urge the circuit board with a plurality of surface mounted electrical components in thermal contact with the housing. Once the heat sink is assembled the invention provides various means for which heat can be readily transferred from the electrical components to the housing. Heat can be transferred away from the electrical component to the housing through a thermal via incorporated within the circuit board, though the resilient biasing element, or by direct contact of the electrical component and the housing.

REFERENCES:
patent: 4674005 (1987-06-01), Lacz
patent: 4707726 (1987-11-01), Tinder
patent: 4845590 (1989-07-01), Mikolajczak
patent: 4891735 (1990-01-01), Mikolajczak
patent: 4922601 (1990-05-01), Mikolajczak
patent: 4923179 (1990-05-01), Mikolajczak
patent: 5003429 (1991-03-01), Baker et al.
patent: 5065279 (1991-11-01), Lazenby et al.
patent: 5138523 (1992-08-01), Benck et al.
patent: 5212627 (1993-05-01), No
patent: 5276584 (1994-01-01), Collins et al.
patent: 5280409 (1994-01-01), Selna et al.
patent: 5296739 (1994-03-01), Heilbronner et al.
patent: 5307236 (1994-04-01), Rio et al.
patent: 5402313 (1995-03-01), Casperson et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5590026 (1996-12-01), Warrent et al.
patent: 5623394 (1997-04-01), Sherif et al.
patent: 5880093 (1999-03-01), Markow et al.

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