Heat sink assembly for densely packed transistors

Details Heat sink assembly for densely packed transistors Heat sink assembly for densely packed transistors

1988-12-19

1989-10-03

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 163, 357 81, 361417, H05K 720

Patent

active

048720895

ABSTRACT:
A heat sink assembly for a plurality of transistors includes specially-formed spring clips and a specially-formed heat sink to hold the transistors firmly on the heat sink, and a lead protector that mates with the heat sink to receive and protect the leads of the transistors during handling. The lead protector and the heat sink include integrally-formed fastener/alignment pins for aligning the lead protector with the heat sink, and for aligning the completed heat sink assembly with a circuit board and for holding the assembly securely fastened to the circuit board. A particular feature of the lead protector permits it to mate with heat sink in a first discrete position in which it receives and protects the transistor leads, and to more closely mate with the heat sink in a second discrete position in which the transistor leads pass through the lead protector and into target holes in the circuit board.

REFERENCES:
patent: 4667270 (1987-05-01), Yagi
patent: 4674005 (1987-06-01), Lacz
patent: 4710852 (1987-12-01), Keen
patent: 4803545 (1989-02-01), Birkle
patent: 4821152 (1989-04-01), Lorenzen

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