Heat sink assembly for cooling electronic components

Details Heat sink assembly for cooling electronic components Heat sink assembly for cooling electronic components

1991-04-15

1992-11-10

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 803, 165185, 174 152, 357 79, 357 80, 357 81, 361382, 361386, H05K 720

Patent

active

051629747

ABSTRACT:
A heat sink system for cooling electronic components and especially integrated circuits on a printed circuit board is disclosed. A heat sink having a heat pipe and a plurality of fins spaced and positioned perpendicular to the longitudinal axis of the heat pipe is connected at one end to a heat collector. The surface of the heat collector is urged by a spring biasing mechanism into secure thermal contact with a heat spreader connected to the integrated circuit package. The heat collector consists of two sections. One section is connected to one end of the heat pipe and has a hemispherically shaped end. The other section has an associated mating hemispherically shaped socket and is connected to the heat spreader. The two sections form a hemispherical interface serving both to increase the thermal efficiency of the heat sink and to act as a self-positioning mechanism.

REFERENCES:
patent: 2958021 (1960-10-01), Cornelison et al.
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4908695 (1990-03-01), Morihara et al.
patent: 4951740 (1990-08-01), Peterson et al.
Meeker et al., "Module Thermal Cap for Semiconductor Chip Package", vol. 20 No. 7 Dec. 1977, pp. 2699-2671.

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