Heat sink assembly for an integrated circuit

Details Heat sink assembly for an integrated circuit Heat sink assembly for an integrated circuit

1996-04-05

1997-02-18

Leo, Leonard R.

Heat exchange

With retainer for removable article

Electrical component

165121, 165185, 174 163, 257718, 257719, 361657, 361704, F28F 700, H01L 2302

Patent

active

056033745

ABSTRACT:
A heat sink assembly for an integrated circuit comprises a base plate defining a central opening and an integrated circuit receiving slot, a fin plate defining a downwardly extending protrusion, a fan fixedly mounted on a top of the fin, and screws for connecting the fin plate and the base plate together whereby the downwardly extending protrusion of the fin plate is extended through the opening of the base plate.

REFERENCES:
patent: 4607685 (1986-08-01), Mitchell, Jr.
patent: 4712159 (1987-12-01), Clemens
patent: 5313099 (1994-05-01), Tata et al.
patent: 5375652 (1994-12-01), Matsunaga et al.
patent: 5421402 (1995-06-01), Lin
patent: 5495392 (1996-02-01), Shen
patent: 5522700 (1996-06-01), Hong
patent: 5541811 (1996-07-01), Henningsson et al.

Affiliated with

Also associated with

Rating

Heat sink assembly for an integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink assembly for an integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink assembly for an integrated circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1596743