Heat sink assembly for an electrical socket

Details Heat sink assembly for an electrical socket Heat sink assembly for an electrical socket

1999-12-29

2001-11-13

Tolin, Gerald (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S719000

Reexamination Certificate

active

06317323

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to a heat sink assembly for an electrical socket, and particularly to a heat sink assembly which is effectively positioned and has a low cost.
Today's computer technology transmits information at higher and higher rates. As transmission speed increases, the heat produced by the internal electronic elements increases correspondingly. This heat must be dissipated efficiently, otherwise the rising temperature in the computer will cause a system malfunction.
Prior art Taiwan Patent Nos.85209788, 84218687and 83217100disclose heat sink assemblies having a heat sink body in contact with an electronic element. The heat sink body is formed from extruded aluminum and comprises a bottom glazed surface abutting the electronic element to absorb heat therefrom and a plurality of fins projecting upward from a base to dissipate the heat. A latching member closely binds the heat sink to the electronic element by latching to a pair of lugs formed on a socket mounting the electronic element. However, a channel must be cut in the heat sink body for receiving the latching member, which complicates the manufacture process. Additionally, the smooth, glazed surface of the heat sink abuts the electronic element, so the heat sink body is difficult to position accurately and may easily slide along the electric element after assembly. Hence, an improved electrical connector is required to overcome the disadvantages of the prior art.
BRIEF SUMMARY OF THE INVENTION
An essential object of the present invention is to provide a heat sink assembly which can be effectively positioned and has a low cost.
A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member. The heat sink comprises a base plate and a plurality of fins projecting upward from a top surface thereof. A receiving channel is integrally formed between the plurality of fins for receiving the latching member. The base plate defines an enlarged recess adjacent to the receiving channel to prevent interference with the normal operation of the electric socket. A pair of positioning pins depend downward from a bottom surface of the base plate for positioning the heat sink on a CPU mounted on the electric socket and keeping it from moving along the CPU.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.


REFERENCES:
patent: 5594624 (1997-01-01), Clemens
patent: 5638258 (1997-06-01), Lin
patent: 5660562 (1997-08-01), Lin
patent: 5684676 (1997-11-01), Lin
patent: 5933325 (1999-08-01), Hou
patent: 5933326 (1999-08-01), Lee

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