Heat sink assembly for a potted housing

Details Heat sink assembly for a potted housing Heat sink assembly for a potted housing

2006-09-12

2006-09-12

Datskovsky, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S709000, C165S080200, C174S520000, C174S521000

Reexamination Certificate

active

07106593

ABSTRACT:
The present invention includes a heat sink assembly within a potted housing and a method for transferring heat within a potted housing. The heat sink assembly includes a bracket, a heat-containing element, and a self-tapping screw operatively arranged to engage the bracket and the heat-containing element. The screw presses the heat-containing element against the bracket. In some cases, the bracket is brass. In some cases, the housing is for a fuel pump and the heat-containing element includes a printed circuit board with an oscillating circuit and a heat sink.

REFERENCES:
patent: 3522486 (1970-08-01), Norman et al.
patent: 3699937 (1972-10-01), De Petris
patent: 3783345 (1974-01-01), Taylor et al.
patent: 3797522 (1974-03-01), Carleton
patent: 4035109 (1977-07-01), Drath et al.
patent: 4042955 (1977-08-01), Imai et al.
patent: 4160629 (1979-07-01), Hidden et al.
patent: 4169696 (1979-10-01), Brown
patent: 4288839 (1981-09-01), Prager et al.
patent: 4299544 (1981-11-01), Masaka
patent: 4306842 (1981-12-01), Masaka
patent: 4464613 (1984-08-01), Brown
patent: 4502090 (1985-02-01), Sloan
patent: 4643653 (1987-02-01), Masaka et al.
patent: 4749343 (1988-06-01), Brown
patent: 4998865 (1991-03-01), Nakanishi et al.
patent: 5504653 (1996-04-01), Murphy et al.
patent: 5593287 (1997-01-01), Sadakata et al.
patent: 5613844 (1997-03-01), Tuckey et al.
patent: 5749516 (1998-05-01), Humburg
patent: 5832903 (1998-11-01), White et al.
patent: 5908286 (1999-06-01), Clemmons
patent: 5961293 (1999-10-01), Clemmons et al.
patent: 6262893 (2001-07-01), Liu
patent: 6618255 (2003-09-01), Fairchild
patent: 2001/0051098 (2001-12-01), Kenney et al.
patent: 2002/0051642 (2002-05-01), Hicks
patent: 2003/0085791 (2003-05-01), Ramahi et al.
patent: 3126100 (1983-01-01), None
patent: 64001261 (1989-01-01), None

Affiliated with

Also associated with

Rating

Heat sink assembly for a potted housing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink assembly for a potted housing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink assembly for a potted housing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3537554