Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-09-17
2010-06-08
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S185000, C257S719000, C361S710000, C361S715000, C361S716000, C361S719000
Reexamination Certificate
active
07733652
ABSTRACT:
A heat sink assembly includes a base frame and a heat sink having a module engagement surface configured to be in thermal communication with an engagement surface of a pluggable module. The heat sink assembly also includes transfer links extending between the heat sink and the base frame. The transfer links are movable to transfer the heat sink with respect to the base frame. The heat sink is movable between a recessed position and an elevated position, wherein the transfer links maintain the heat sink in a predetermined orientation with respect to the engagement surface of the pluggable module as the heat sink is transferred, between the recessed position and the elevated position.
REFERENCES:
patent: 4825337 (1989-04-01), Karpman
patent: 5161087 (1992-11-01), Frankeny et al.
patent: 5640302 (1997-06-01), Kikinis
patent: 6086387 (2000-07-01), Gallagher et al.
patent: 6205023 (2001-03-01), Moribe et al.
patent: 6816376 (2004-11-01), Bright et al.
patent: 6817886 (2004-11-01), Amorim
patent: 6942506 (2005-09-01), Kimura et al.
patent: 7001217 (2006-02-01), Bright et al.
patent: 7036574 (2006-05-01), Thompson et al.
patent: 7090519 (2006-08-01), Muramatsu et al.
patent: 7133285 (2006-11-01), Nishimura
patent: 7355857 (2008-04-01), Pirillis et al.
patent: 7518870 (2009-04-01), Choi et al.
patent: 2003/0171016 (2003-09-01), Bright et al.
patent: 2005/0162834 (2005-07-01), Nishimura
Cole Jordan Marshall
Costello Brian Patrick
Thompson Gregory D
Tyco Electronics Corporation
LandOfFree
Heat sink assembly for a pluggable module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink assembly for a pluggable module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink assembly for a pluggable module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4156392