Heat sink assembly employing spring-loaded standoffs

Details Heat sink assembly employing spring-loaded standoffs Heat sink assembly employing spring-loaded standoffs

1996-06-06

1998-05-26

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257719, 361809, H05K 720

Patent

active

057576211

ABSTRACT:
A heat sink may be shared among a plurality of electronic devices attached to a printed circuit board by attaching the heat sink to the printed circuit board using a plurality of standoff/spring combinations. In this way, the level of compression imposed by the springs on the heat sink allows the heat sink to make the appropriate level of thermal contact with the electronic devices.

REFERENCES:
patent: 5384940 (1995-01-01), Soule et al.
patent: 5590026 (1996-12-01), Warren et al.
patent: 5603374 (1997-02-01), Wu
patent: 5621615 (1997-04-01), Dawson et al.

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