Heat sink assembly and method of attaching a heat sink to an...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S719000

Reexamination Certificate

active

10607783

ABSTRACT:
A heat sink assembly is coupled to a motherboard and an electronic device on the motherboard. The heat sink assembly includes a heat sink with an opening extending through the heat sink, and a pin that extends through the motherboard and the opening in the heat sink to couple the heat sink to the electronic device and the motherboard. A member within the opening in the heat sink is positioned between the heat sink and the pin. A method of securing a heat sink to a motherboard and an electronic device on the motherboard includes thermally coupling a heat sink to an electronic device, securing the heat sink to a motherboard using a pin that extends through an opening in the heat sink, and positioning a member between the pin and the heat sink within the opening in the heat sink.

REFERENCES:
patent: 3728584 (1973-04-01), Kuhlow
patent: 4266267 (1981-05-01), Ruegg
patent: 4321423 (1982-03-01), Johnson et al.
patent: 4546408 (1985-10-01), Rodseth et al.
patent: 4587377 (1986-05-01), Rodseth
patent: 5883782 (1999-03-01), Thurston et al.
patent: 6046905 (2000-04-01), Nelson et al.
patent: 6317328 (2001-11-01), Su
patent: 6549410 (2003-04-01), Cohen
patent: 6822867 (2004-11-01), Hsieh
patent: 2004/0130876 (2004-07-01), Davison

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