Heat exchange – With retainer for removable article – Electrical component
Patent
1995-11-06
1997-08-05
Leo, Leonard R.
Heat exchange
With retainer for removable article
Electrical component
165185, 174 163, 361704, 361707, F28F 700
Patent
active
056532806
ABSTRACT:
A method of affixing heat sink assemblies to integrated circuit devices includes the following steps (1) providing a first heat sink assembly having a first base, with the first base having a first layer of adhesive material disposed thereon, and with a first strippable liner positioned over and in contact with the first layer of adhesive material, (2) removing the first strippable liner from the first layer of adhesive material, (3) positioning the first heat sink assembly in contact with a first integrated circuit device mounted on a printed circuit board such that the first layer of adhesive material is interposed between the first base and the first integrated circuit device, (4) removing the first integrated circuit device from the printed circuit board, (5) providing a second heat sink assembly having a second base, with the second base having a second layer of adhesive material disposed thereon, and with a second strippable liner positioned over and in contact with the second layer of adhesive material, (6) removing the second strippable liner from the second layer of adhesive material, (7) positioning the second heat sink assembly in contact with a second integrated circuit device such that the second layer of adhesive material is interposed between the second base and the second integrated circuit device, and (8) mounting the second integrated circuit device to the printed circuit board. A heat sink assembly having a base, a plurality of thermally conductive fins and a layer of adhesive material disposed on the base is also disclosed.
REFERENCES:
patent: 2711382 (1955-06-01), Smith-Johannsen
patent: 3694182 (1972-09-01), Akfirat et al.
patent: 3836825 (1974-09-01), Hall et al.
patent: 3972821 (1976-08-01), Weidenbenner et al.
patent: 4654754 (1987-03-01), Daszkowski
patent: 4730666 (1988-03-01), Flint et al.
patent: 4733453 (1988-03-01), Jacoby
patent: 4838347 (1989-06-01), Dentini et al.
patent: 5038858 (1991-08-01), Jordan et al.
patent: 5168348 (1992-12-01), Chu et al.
patent: 5168926 (1992-12-01), Watson et al.
patent: 5265321 (1993-11-01), Nelson et al.
patent: 5270902 (1993-12-01), Bellar et al.
patent: 5285108 (1994-02-01), Hastings et al.
patent: 5309321 (1994-05-01), Olla et al.
patent: 5353193 (1994-10-01), Chia et al.
patent: 5366688 (1994-11-01), Terpstra et al.
patent: 5397919 (1995-03-01), Tata et al.
Leo Leonard R.
Maginot Paul J.
NCR Corporation
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