Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-10-10
2001-10-16
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S709000, C165S080300, C174S016300, C257S718000, C257S719000, C257S727000, C411S516000, C411S522000, C411S523000, C024S458000
Reexamination Certificate
active
06304453
ABSTRACT:
BACKGROUND
1. Field of the Invention
The present invention relates to a heat sink assembly, and particularly to a heat sink assembly having holders for securely retaining a heat sink on a heat-generating electronic device.
2. The Related Art
Many electronic devices, such as Central Processing Units (CPUs) generate large amounts of heat during operation. The heat frequently deteriorates the operational stability of the electronic devices. A heat sink is often attached to a CPU to remove heat therefrom. Various clips have been used for attaching a heat sink to a CPU.
FIG. 3
shows a conventional clip
16
attaching a heat sink
10
to a CPU
13
. A ridge
12
extends downwardly from a bottom surface of the heat sink
10
, and is received in a gap
18
between a connector
14
and the CPU
13
. When this assembly is subjected to shock, the ridge
12
cooperates with the clip
16
to prevent the heat sink
10
from moving with respect to the CPU
13
. However, the gap
18
is relatively narrow, and the corresponding ridge
12
is sometimes too small to properly secure the heat sink
10
under shock conditions. Furthermore, the size of the ridge
12
must be precisely manufactured, to ensure that it accurately mates with the gap
18
.
Therefore, a heat sink assembly is desired to solve the above-mentioned problems.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a heat sink assembly having a plurality of holders for preventing the heat sink from moving when subjected to shock.
Another object of the present invention is to provide a heat sink assembly which is readily attached to an electronic device, and readily detached therefrom.
To achieve the above-mentioned objects, a heat sink assembly in accordance with the present invention comprises a heat sink, a clip and two pairs of holders. The heat sink has a base and a plurality of fins extending perpendicularly from the base. A groove is defined in each of two opposite side surfaces of the base. The clip presses the heat sink onto an electronic device mounted on a socket. Each holder has a fixing portion for being interferentially inserted into the groove of the heat sink, and a positioning portion for engaging with a side surface of the socket. Thus the clip and the four holders prevent the heat sink from moving with respect to the electronic device.
Other objects, advantages and novel features of the present invention will be drawn from the following detailed embodiment of the present invention with attached drawings, in which:
REFERENCES:
patent: 5304735 (1994-04-01), Earl et al.
patent: 5684676 (1997-11-01), Lin
patent: 6205026 (2001-03-01), Wong et al.
Chervinsky Boris L.
Chung Wei Te
Foxconn Precision - Components Co., Ltd.
Picard Leo P.
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