Heat sink assembly

Details Heat sink assembly Heat sink assembly

2005-09-06

2005-09-06

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S707000, C174S252000

Reexamination Certificate

active

06940725

ABSTRACT:
A heat sink assembly for use in an electrical apparatus having a printed circuit board having an electromagnetic device is disclosed. The heat sink assembly comprises a first heat-dissipating piece disposed between the electromagnetic device and the printed circuit board for transferring the heat generated from the electromagnetic device away the printed circuit board, and a second heat-dissipating piece disposed on the edge of the printed circuit board and contacting with the first heat-dissipating piece for transferring the heat from the first heat-dissipating piece away the printed circuit board.

REFERENCES:
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patent: 5754401 (1998-05-01), Saneinejad et al.
patent: 5940272 (1999-08-01), Emori et al.
patent: 6377462 (2002-04-01), Hajicek et al.
patent: 04113695 (1992-04-01), None

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