Heat sink arrangement for electrical apparatus

Details Heat sink arrangement for electrical apparatus Heat sink arrangement for electrical apparatus

2006-05-22

2009-08-25

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S252000

Reexamination Certificate

active

07579554

ABSTRACT:
A printed circuit board (120) includes an insulating substrate (120a) on which conductive films (120b) are formed. Semiconductor devices (8) disposed external to the printed circuit board (120) have their leads (24a,24b,24c) connected to the conductive films. A flexible portion (30) is formed in the insulating substrate (120a) at a location near the location where the leads (24a,24b,24c) are connected to the conductive films (120b).

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patent: 004231140 (1994-03-01), None
patent: 07-007167 (1995-01-01), None

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