Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-04-09
1998-10-27
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361695, 361704, 361709, 361710, 257706, 257707, 257717, 257718, 257719, 257721, 257722, 257727, 174 163, 165803, H05K 720
Patent
active
058285512
ABSTRACT:
A heat sink apparatus of the present invention comprises a heat conductive base comprising a plate member having a first surface and a second surface, a plurality of heat dissipation fins projecting upwardly from the first surface and extending radially toward a circumference of the plate member, the second surface being adapted to be in contact engagement with a surface of the electronic device, the first surface slopping down radially toward the circumference of the plate member, and a fan assembly mounted above the heat dissipation fins. The second surface is substantially flat and a thickness of the plate member decreases radially toward the circumference of the plate member. The heat dissipation fins are arranged to define a non-finned zone of the first surface and the non-finned zone is a concave. The heat sink apparatus further comprises a casing includes an upper wall, a lower surface of which is positioned adjacent to upper edges of the heat dissipation fins.
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Hoshino Izumi
Matsushima Hideo
Chervinsky Boris
Hoshino Kinzoku Koygo Kabushiki Kaisha
Picard Leo P.
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