Heat sink apparatus and method for allowing air to flow...

Details Heat sink apparatus and method for allowing air to flow... Heat sink apparatus and method for allowing air to flow...

2011-06-21

2011-06-21

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S703000, C361S709000, C165S080300, C174S016300, C257S717000, C257S722000

Reexamination Certificate

active

07965506

ABSTRACT:
A heat sink apparatus and method are provided for allowing air to flow directly to an integrated circuit package thereunder. In use, a heat sink is provided including an upper portion with a plurality of fins, and a lower portion configured for allowing air to flow directly to an integrated circuit package thereunder.

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