Heat sink apparatus

Details Heat sink apparatus Heat sink apparatus

2006-04-13

2008-10-28

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S709000, C165S080300

Reexamination Certificate

active

07443684

ABSTRACT:
The present invention relates to a heat sink apparatus, which discloses that by using a meshed member as a heat sink member, the heat-sinking efficiency will be enhanced owing to increased surface areas. Furthermore, a first linear member is made to contact with a substrate at non-perpendicular angles to increase the stresses thereof, and hence the heat sink member is more resistive to deformation during processing. In addition, the meshed member also provides multiple heat flow paths to enhance heat-sinking efficiency. The heat sink member according to the present invention can also be a 3D fabric, which further improves heat-sinking efficiency from 2D to 3D fabrics. Besides, the heat sink member includes an expanded metal-lath member.

REFERENCES:
patent: 4843693 (1989-07-01), Chisholm
patent: 5180001 (1993-01-01), Okada et al.
patent: 5358032 (1994-10-01), Arai et al.
patent: 5728622 (1998-03-01), Yu
patent: 5960863 (1999-10-01), Hua
patent: 6561267 (2003-05-01), Sauciuc et al.
patent: 358125855 (1983-07-01), None

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